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Functional Testing
FBM: In the memory region, the bits are arranged in rows and columns. If one or two…
Testing Basics
Basics: In this chapter we will learn the details of testing a IC during and…
Chemical mechanical planarization (CMP)
The production level CMP tool will be approximately 6 feet tall and 8 feet in…
Dry etching
In dry etching, chemical reaction occurs between the material on the wafer and the gases. …
Wet Etching
We saw that during deposition, it is not possible to deposit a material only in…
Diffusion- production issues
Dopant redistribution: The doped silicon is oxidized in some places, as part of the process sequence.…
Limited source diffusion
A plot of the concentration profile (normalized with respect to Cs) , at various times,…
Physical vapor deposition and chemical deposition
Collimated and Ionized Metal Plasma (IMP): There are some more advanced techniques in the PVD. One…
Deposition Techniques
In this chapter we will see various deposition techniques that are used in microelectronic fabrication.…
OXIDATION
In semiconductor manufacturing the term “oxidation” is used to refer the conversion of silicon to…