Posted inRenewable Energy Systems
Dry etching
In dry etching, chemical reaction occurs between the material on the wafer and the gases. …
Wet Etching
We saw that during deposition, it is not possible to deposit a material only in…
Diffusion- production issues
Dopant redistribution: The doped silicon is oxidized in some places, as part of the process sequence.…
Limited source diffusion
A plot of the concentration profile (normalized with respect to Cs) , at various times,…
Physical vapor deposition and chemical deposition
Collimated and Ionized Metal Plasma (IMP): There are some more advanced techniques in the PVD. One…
Deposition Techniques
In this chapter we will see various deposition techniques that are used in microelectronic fabrication.…
OXIDATION
In semiconductor manufacturing the term “oxidation” is used to refer the conversion of silicon to…
Ion Implanatation – non idealities
Why are the neutral atoms removed from the beam just before deposition? The total quantity…
Ion Implanatation
We saw that material can be deposited on the silicon wafer by various techniques such as PVD,…
Diffusion basics & constant source diffusion
In the previous chapter, we saw that the silicon should be changed to “N” type…