Posted inLinear integrated circuits and applications Wet Etching Posted by admin August 11, 2021 We saw that during deposition, it is not possible to deposit a material only in…
Posted inLinear integrated circuits and applications Diffusion- production issues Posted by admin August 11, 2021 Dopant redistribution: The doped silicon is oxidized in some places, as part of the process sequence.…
Posted inLinear integrated circuits and applications Limited source diffusion Posted by admin August 11, 2021 A plot of the concentration profile (normalized with respect to Cs) , at various times,…
Posted inLinear integrated circuits and applications Physical vapor deposition and chemical deposition Posted by admin August 11, 2021 Collimated and Ionized Metal Plasma (IMP): There are some more advanced techniques in the PVD. One…
Posted inLinear integrated circuits and applications Deposition Techniques Posted by admin August 11, 2021 In this chapter we will see various deposition techniques that are used in microelectronic fabrication.…
Posted inLinear integrated circuits and applications OXIDATION Posted by admin August 11, 2021 In semiconductor manufacturing the term “oxidation” is used to refer the conversion of silicon to…
Posted inLinear integrated circuits and applications Ion Implanatation – non idealities Posted by admin August 11, 2021 Why are the neutral atoms removed from the beam just before deposition? The total quantity…
Posted inLinear integrated circuits and applications Ion Implanatation Posted by admin August 11, 2021 We saw that material can be deposited on the silicon wafer by various techniques such as PVD,…
Posted inLinear integrated circuits and applications Diffusion basics & constant source diffusion Posted by admin August 11, 2021 In the previous chapter, we saw that the silicon should be changed to “N” type…
Posted inLinear integrated circuits and applications ETCHING Posted by admin August 11, 2021 Etching PCB is to use the materials of chemical reactions or physical impact of technologies…